Montage Technology Co Ltd (Ticker: 6809 HK) is a China-based fabless integrated circuit design company specializing in interconnect solutions for cloud computing and artificial intelligence infrastructure. The company focuses on developing high-performance memory interface chips, including solutions for DDR2 through DDR5 standards, as well as PCIe and CXL interconnect chips designed to address data transmission bottlenecks in data centers. According to industry reports, Montage Technology ranked as the largest memory interconnect chip supplier globally by revenue in 2024, holding a 36.8% market share.

Montage Technology plans to list on the Hong Kong Stock Exchange on February 9, 2026. The company is offering 65.89 million H-shares at an expected price of HKD 106.89 per share. The IPO aims to raise approximately HKD 7.04 billion, which is equivalent to roughly USD 902 million. According to filing documents, the company plans to use the proceeds for research and development, expanding product capacity, brand promotion, business development, and potential strategic acquisitions. The offering is jointly sponsored by CICC, Morgan Stanley, and UBS, with Goldman Sachs and CLSA also acting as underwriters.